• DocumentCode
    3169733
  • Title

    The development of high sensitivity NTC thermistors

  • Author

    Yamamoto, Hiroshi ; Shibata, Akira ; Hajime, Keibunn ; Takao, Fumio ; Sugisawa, Katsuhiko ; Niwatsukino, Yoshiyuki ; Shishiba, Hideki ; Takeda, Shu-ichi

  • Author_Institution
    Komatsu Ltd., Kanagawa, Japan
  • fYear
    1991
  • fDate
    33457
  • Firstpage
    735
  • Lastpage
    738
  • Abstract
    Several requirements for NTC thermistors used for office automation (OA) equipment and home electronics are small size, high sensitivity and high reliability. Commonly used NTC thermistors do not have adequate reliability against thermal shock. Size reduction is difficult due to the multi-phase structure and porosity in ceramics. It is also difficult to realize the required properties because the resistivity-B value relationship control method has not been established. So we have developed a method to control the properties of NTC thermistor by controlling the numbers and the valence of solid solution ions on A and B sites in the single phase spinel structure. Based on these methods, we have also established a method to make a more dense structure. A NTC thermistor series has been developed possessing small size, high sensitivity and high reliability
  • Keywords
    ceramics; electric sensing devices; semiconductor device reliability; thermal shock; thermistors; valency; high sensitivity NTC thermistors; home electronics; office automation equipment; reliability; resistivity-B value relationship control method; sensitivity; single phase spinel structure; size reduction; solid solution ions; thermal shock; valence; Ball milling; Ceramics; Crystalline materials; Electric shock; Facsimile; Manufacturing processes; Office automation; Powders; Process design; Thermistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Ferroelectrics, 1994.ISAF '94., Proceedings of the Ninth IEEE International Symposium on
  • Conference_Location
    University Park, PA
  • Print_ISBN
    0-7803-1847-1
  • Type

    conf

  • DOI
    10.1109/ISAF.1994.522474
  • Filename
    522474