• DocumentCode
    3170203
  • Title

    Efficient VLSI module placement with solution space smoothing

  • Author

    Dong, Sheqin ; Hong, Xianlong ; Zhou, Shuo ; Gu, Jun

  • Author_Institution
    Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
  • Volume
    2
  • fYear
    2002
  • fDate
    29 June-1 July 2002
  • Firstpage
    1396
  • Abstract
    Due to the rugged terrain surface of the search space of a placement instance, it often is stuck at a locally optimum configuration. In this paper, we propose a solution space smoothing technique for VLSI block placement. A placement instance with the simplest terrain structure is solved first, and the original problem instance with more complicated terrain structure is solved last. The solutions of the simplified problem instances are used to guide the search of more complicated ones. Compared with the simulated annealing algorithm, the solution space smoothing method needs few control parameters and the parameters are easy to determine. Experimental results of MCNC benchmarks show that solution space smoothing is very efficient for VLSI module placement. It can be applied to floorplanning representations, such as BSG, SP, CBL, B*-tree, O-tree, etc.
  • Keywords
    VLSI; circuit complexity; circuit layout CAD; integrated circuit layout; search problems; trees (mathematics); B-tree; BSG floorplanning; CBL floorplanning; MCNC benchmarks; O-tree; SP floorplanning; VLSI block placement; VLSI module placement; building block layout; complicated terrain structure; control parameters; floorplanning representations; locally optimum configuration; placement search space; rugged terrain surface; simple terrain structure; simulated annealing algorithm; solution space smoothing; Computer science; Cooling; Process design; Rough surfaces; Simulated annealing; Smoothing methods; Space technology; Surface roughness; Testing; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications, Circuits and Systems and West Sino Expositions, IEEE 2002 International Conference on
  • Print_ISBN
    0-7803-7547-5
  • Type

    conf

  • DOI
    10.1109/ICCCAS.2002.1179041
  • Filename
    1179041