DocumentCode :
3170203
Title :
Efficient VLSI module placement with solution space smoothing
Author :
Dong, Sheqin ; Hong, Xianlong ; Zhou, Shuo ; Gu, Jun
Author_Institution :
Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
Volume :
2
fYear :
2002
fDate :
29 June-1 July 2002
Firstpage :
1396
Abstract :
Due to the rugged terrain surface of the search space of a placement instance, it often is stuck at a locally optimum configuration. In this paper, we propose a solution space smoothing technique for VLSI block placement. A placement instance with the simplest terrain structure is solved first, and the original problem instance with more complicated terrain structure is solved last. The solutions of the simplified problem instances are used to guide the search of more complicated ones. Compared with the simulated annealing algorithm, the solution space smoothing method needs few control parameters and the parameters are easy to determine. Experimental results of MCNC benchmarks show that solution space smoothing is very efficient for VLSI module placement. It can be applied to floorplanning representations, such as BSG, SP, CBL, B*-tree, O-tree, etc.
Keywords :
VLSI; circuit complexity; circuit layout CAD; integrated circuit layout; search problems; trees (mathematics); B-tree; BSG floorplanning; CBL floorplanning; MCNC benchmarks; O-tree; SP floorplanning; VLSI block placement; VLSI module placement; building block layout; complicated terrain structure; control parameters; floorplanning representations; locally optimum configuration; placement search space; rugged terrain surface; simple terrain structure; simulated annealing algorithm; solution space smoothing; Computer science; Cooling; Process design; Rough surfaces; Simulated annealing; Smoothing methods; Space technology; Surface roughness; Testing; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Communications, Circuits and Systems and West Sino Expositions, IEEE 2002 International Conference on
Print_ISBN :
0-7803-7547-5
Type :
conf
DOI :
10.1109/ICCCAS.2002.1179041
Filename :
1179041
Link To Document :
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