DocumentCode :
3170363
Title :
Technical co-sponsor
fYear :
2010
fDate :
2-4 June 2010
Firstpage :
135
Lastpage :
135
Abstract :
The conference organizers greatly appreciate the support of the various corporate sponsors listed.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
MECHATRONIKA, 2010 13th International Symposium
Conference_Location :
Trencianske Teplice
Print_ISBN :
978-1-4244-7962-7
Type :
conf
Filename :
5521199
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3170363
