DocumentCode
3171257
Title
High-k/Metal Gates- from research to reality
Author
Narayanan, V.
Author_Institution
IBM, Yorktown Heights
fYear
2007
fDate
16-20 Dec. 2007
Firstpage
42
Lastpage
45
Abstract
Miniaturization of the Si MOSFET required in order to attain higher transistor performance and greater economies of scale have spurred the need for significant materials innovations. This is most apparent in the search for the ideal high-k/metal gate stack as replacement for conventional SiON/Poly-Si gate stacks. In this paper, some of the key advances that have made high-k/metal gate stacks a reality will be reviewed. The innovations included optimized metal and interfaces for improved electron mobility in HfO2/metal gate stacks and insertion of nanoscale gp. IIA and IIIB elements layers between the HfO2 and metal electrode stack for band-edge nMOSFETs. Significant hurdles prevented similar solutions for pMOSFET stacks, primarily due to the presence of thermally activated point defects. However, by careful engineering optimization, pMOSFETs have also been realized, resulting in scalable high performance CMOS using High-k/metal gate stacks.
Keywords
CMOS integrated circuits; MOSFET; electron mobility; hafnium compounds; high-k dielectric thin films; nanoelectronics; optimisation; CMOS; HfO2; band-edge nMOSFET; electron mobility; high-k/metal gate stacks; nanoscale insertion; optimization; pMOSFET; Economies of scale; Electron mobility; Electrostatics; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; MOSFET circuits; Permission; Technological innovation; Threshold voltage; Electron Mobility; High-k; Metal Gates; Oxygen Vacancies;
fLanguage
English
Publisher
ieee
Conference_Titel
Physics of Semiconductor Devices, 2007. IWPSD 2007. International Workshop on
Conference_Location
Mumbai
Print_ISBN
978-1-4244-1728-5
Electronic_ISBN
978-1-4244-1728-5
Type
conf
DOI
10.1109/IWPSD.2007.4472451
Filename
4472451
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