• DocumentCode
    3171257
  • Title

    High-k/Metal Gates- from research to reality

  • Author

    Narayanan, V.

  • Author_Institution
    IBM, Yorktown Heights
  • fYear
    2007
  • fDate
    16-20 Dec. 2007
  • Firstpage
    42
  • Lastpage
    45
  • Abstract
    Miniaturization of the Si MOSFET required in order to attain higher transistor performance and greater economies of scale have spurred the need for significant materials innovations. This is most apparent in the search for the ideal high-k/metal gate stack as replacement for conventional SiON/Poly-Si gate stacks. In this paper, some of the key advances that have made high-k/metal gate stacks a reality will be reviewed. The innovations included optimized metal and interfaces for improved electron mobility in HfO2/metal gate stacks and insertion of nanoscale gp. IIA and IIIB elements layers between the HfO2 and metal electrode stack for band-edge nMOSFETs. Significant hurdles prevented similar solutions for pMOSFET stacks, primarily due to the presence of thermally activated point defects. However, by careful engineering optimization, pMOSFETs have also been realized, resulting in scalable high performance CMOS using High-k/metal gate stacks.
  • Keywords
    CMOS integrated circuits; MOSFET; electron mobility; hafnium compounds; high-k dielectric thin films; nanoelectronics; optimisation; CMOS; HfO2; band-edge nMOSFET; electron mobility; high-k/metal gate stacks; nanoscale insertion; optimization; pMOSFET; Economies of scale; Electron mobility; Electrostatics; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; MOSFET circuits; Permission; Technological innovation; Threshold voltage; Electron Mobility; High-k; Metal Gates; Oxygen Vacancies;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physics of Semiconductor Devices, 2007. IWPSD 2007. International Workshop on
  • Conference_Location
    Mumbai
  • Print_ISBN
    978-1-4244-1728-5
  • Electronic_ISBN
    978-1-4244-1728-5
  • Type

    conf

  • DOI
    10.1109/IWPSD.2007.4472451
  • Filename
    4472451