Title :
Optical communication directly through stacked CMOS circuits operating at 50 Mbps
Abstract :
Optical interconnects are an attractive replacement for electrical interconnections in high performance systems. They can provide high speed, high bandwidth, low loss, massively parallel, crosstalk resistant interconnections for use in clock distribution and three-dimensional computer technologies by utilizing signal guiding layers. They have also been demonstrated in optoelectronic multi-chip modules (OEMCMs) using free space waveguiding and for use in three dimensional (3D) systems using vertical optical through-silicon links. Herein we present the first fully digital, vertical optical, fully integrated (no external sources) through-silicon interconnection with speeds up to 50 Mbps
Keywords :
CMOS digital integrated circuits; clocks; integrated optoelectronics; optical crosstalk; optical interconnections; optical losses; 3D; clock distribution; crosstalk resistant interconnections; free space waveguiding; fully digital vertical optical fully integrated through-silicon interconnection; high bandwidth; high performance systems; high speed; low loss; massively parallel; optical communication; optical interconnects; optoelectronic multi-chip modules; signal guiding layers; stacked CMOS circuits; three dimensional systems; three-dimensional computer technologies; vertical optical through-silicon links; Bandwidth; Clocks; High speed optical techniques; Integrated circuit interconnections; Optical crosstalk; Optical fiber communication; Optical interconnections; Optical losses; Resistance; Space technology;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1997. LEOS '97 10th Annual Meeting. Conference Proceedings., IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3895-2
DOI :
10.1109/LEOS.1997.630584
