DocumentCode
3171688
Title
Breakdown theory of a new SOI composite structure
Author
Li, Zhaoji ; Luo, Luyang ; Guo, Yufeng ; Zhang, Bo ; Fang, Jian ; Zeng, Jun
Author_Institution
IC Design Center, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Volume
2
fYear
2002
fDate
29 June-1 July 2002
Firstpage
1744
Abstract
The new SOI composite structure and its breakdown model are proposed in the paper. The U-type reducing field (URF) structure in lateral direction and the located-hole interface charge (LIC) model for high voltage in vertical direction are developed. By locating hole charge at the interface between the insulator and silicon layer, and satisfying displacement flux continuity, the electric field in the insulator layer is raised from 3 times that of the silicon critical electric field EC,Si to the critical electric field of the insulator SiO2 EC,SiO(2), breaking through the vertical breakdown limit of conventional SOI devices. In the lateral direction, the analytical electric field and potential profiles of the URF are given by decomposing the 2D Poisson equation into two 1D equations. The tradeoff between breakdown voltage and on-resistance are explored according to the simulation and analytical results.
Keywords
MOSFET; Poisson equation; electric fields; interface structure; semiconductor device breakdown; semiconductor device models; silicon-on-insulator; 2D Poisson equation decomposition; LIC model; SOI composite structure; SOI-LDMOS; Si-SiO2; SiO2 insulator critical electric field; U-type reducing field structure; URF structure; breakdown model; breakdown voltage; displacement flux continuity; electric field; high voltage model; insulator/silicon layer interface; interface hole charge; located-hole interface charge model; on-resistance; potential profiles; silicon critical electric field; vertical breakdown limit; Analytical models; Boundary conditions; Breakdown voltage; Dielectrics and electrical insulation; Electric breakdown; Electric potential; Electrodes; Impurities; Poisson equations; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Communications, Circuits and Systems and West Sino Expositions, IEEE 2002 International Conference on
Print_ISBN
0-7803-7547-5
Type
conf
DOI
10.1109/ICCCAS.2002.1179115
Filename
1179115
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