Title :
Boost building block (B3) [DC/DC power conversion]
Author :
Chen, Qing ; Lotfi, Ashraf W. ; Hilburn, Del Ray
Author_Institution :
Lucent Technol., AT&T Bell Labs., Mesquite, TX, USA
Abstract :
This paper presents a method of integrating a boost converter. The basic idea is to integrate all the semiconductor devices and the snubber circuits on a ceramic substrate with an automated assembly process. This integration results in a more compact packaging of the boost converter with a better thermal performance
Keywords :
DC-DC power convertors; packaging; power semiconductor devices; snubbers; substrates; DC/DC power conversion; automated assembly process; boost building block; boost power convertor integration; ceramic substrate; compact packaging; semiconductor devices; snubber circuits; thermal performance; Electronic packaging thermal management; Electronics industry; Electronics packaging; MOSFETs; Power electronics; Power supplies; Snubbers; Switches; Switching circuits; Thermal management;
Conference_Titel :
Telecommunication Energy Conference, 1999. INTELEC '99. The 21st International
Conference_Location :
Copenhagen
Print_ISBN :
0-7803-5624-1
DOI :
10.1109/INTLEC.1999.794112
