Solderability test requirements for plastic surface mount packages

Author

Alger, C.L. ; Pope, D.E. ; Rehm, P.M. ; Sivasubramanian, N.

Author_Institution

Intel Corp., Chandler, AZ, USA

fYear

1989

fDate

25-27 Sep 1989

Firstpage

30

Lastpage

37

Abstract

The development of a filar eyepiece has increased the accuracy and repeatability of measurement of percent coverage after solderability testing. Using this refined dip-and-look or percent-coverage-after-dip method, the differences in hot solder coat and lead-tin solder plate solderability were evaluated. The plated coatings were shown to have better than 10% thickness uniformity across the lead surface. This is reflected in improved solderability after aging. With Sn/Pb plating, 90% coverage can be assured, as compared with the 80% coverage acceptance level for hot solder dip

Keywords

inspection; soldering; surface mount technology; testing; PbSn solder plate; SMD; SMT; aging; dip and look method; filar eyepiece; hot solder coat; inspection; lead surface; percent-coverage-after-dip method; plastic surface mount packages; solderability testing; Coatings; Electronic equipment testing; Lead; Plastic packaging; Pollution measurement; Surface cleaning; Surface contamination; Surface finishing; Temperature; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1989, Proceedings. Seventh IEEE/CHMT International

Conference_Location

San Francisco, CA

Type

conf

DOI

10.1109/EMTS.1989.68948

Filename

68948