DocumentCode
3174209
Title
Comparison between the behavior of submicron graded-channel SOI nMOSFETs with fully- and partially-depleted operations in a wide temperature range
Author
de Souza, M. ; Emam, M. ; Vanhoenacker-Janvier, D. ; Raskin, J.P. ; Flandre, D. ; Pavanello, M.A.
Author_Institution
Dept. of Electr. Eng., Centro Univ. da FEI, Sao Bernardo do Campo, Brazil
fYear
2010
fDate
11-14 Oct. 2010
Firstpage
1
Lastpage
2
Abstract
In this work electrical properties of GC SOI nMOSEETs from two different technologies were presented for temperatures ranging between 90K and 380K. It has been shown that the increase of mobility with temperature reduction is larger than for devices with lighter dopind levels. Heavily doped GC from transistors shown constant threshold voltage over the entire temperature range, as it lies close to the ZTC point. Although the temperature lowering leads devices to operate in full depletion, GC devices with thin gate oxide presented GΓFBE effect due to the leakage current reduction. The subthreshold swing of heavily doped GC transistors have shown to depart the theoretical limit for T higher than 250K, indicating a change in the operation mode from fully to partially-depleted.
Keywords
MOSFET; silicon-on-insulator; doped GC transistor; dopind level; fullyand partially-depleted operation; mobility; submicron graded-channel SOI nMOSFET; temperature reduction; threshold voltage; wide temperature range; Doping; Logic gates; MOSFETs; Temperature distribution; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference (SOI), 2010 IEEE International
Conference_Location
San Diego, CA
ISSN
1078-621x
Print_ISBN
978-1-4244-9130-8
Electronic_ISBN
1078-621x
Type
conf
DOI
10.1109/SOI.2010.5641388
Filename
5641388
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