DocumentCode :
3174653
Title :
Recombination process reversible to the impact ionization and its effect on the simulation of cosmic ray induced failures
Author :
Takata, Ikunori
Author_Institution :
Mitsubishi Electr. Corp., Amagasaki
fYear :
2007
fDate :
16-20 Dec. 2007
Firstpage :
768
Lastpage :
773
Abstract :
If using the traditional recombination model, device simulations of the cosmic ray induced failures revealed that the shorter n--length diode would fail more easily. However, no failure of diodes below 600 V-class, at least, has been reported yet. To explain these experimental results, a strong recombination, which gets bigger together with carrier concentrations, should be necessary. It´s because the inside of the device got uniform and stable if the generation rate and the recombination rate became equal. After the basic consideration on the reactions of carriers, the author arrived at the conclusion that it must be the direct recombination (R prop nenh). The simulation that used this model forecast that low voltage diodes would not be destroyed by cosmic rays. Moreover, a useful clue for the explanation of the resistivity dependency on the failure voltage of the high voltage diodes was also obtained.
Keywords :
avalanche breakdown; carrier density; impact ionisation; radiation hardening (electronics); semiconductor device reliability; semiconductor diodes; avalanche destruction; carrier concentrations; cosmic ray induced failures; direct recombination; impact ionization; radiation hardening; semiconductor diodes; Breakdown voltage; Charge carrier density; Cosmic rays; Engineering profession; Impact ionization; Impurities; Low voltage; Predictive models; Radiative recombination; Semiconductor diodes; cosmic ray induced failure; direct recombination; reversible process to the impact ionization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physics of Semiconductor Devices, 2007. IWPSD 2007. International Workshop on
Conference_Location :
Mumbai
Print_ISBN :
978-1-4244-1728-5
Electronic_ISBN :
978-1-4244-1728-5
Type :
conf
DOI :
10.1109/IWPSD.2007.4472631
Filename :
4472631
Link To Document :
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