O2 plasma induced deionization of high Ag alloy in wire bond integrated circuit

This paper discusses the solution of silver alloy wire deionization. Silver alloy wire has been treated as an alternative material of copper wire in substrate wire bond IC. Since copper wire is too hard to apply to thinner aluminum bond-pad thickness and weaker structure because the bonding pad encountered crack or crater easily. In addition, the hardness of silver is softer than copper wire, and silver has similar characteristic properties as gold. Thus, silver alloy wire will be a better alternative material solution instead of copper wire.