DocumentCode :
3175327
Title :
Integration of electromagnetic passive components in DPS front-end DC/DC converter - a comparative study of different integration steps
Author :
Chen, Rengang ; Canales, F. ; Yang, Bo ; Barbosa, P. ; van Wyk, J.D. ; Lee, F.C.
Author_Institution :
Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Volume :
2
fYear :
2003
fDate :
9-13 Feb. 2003
Firstpage :
1137
Abstract :
In most of the power electronics converters, the overall footprint and profile of the whole system are in large part determined by the footprint and profile of the passive components and the interconnections between them. Integrated magnetics, planar magnetics and passive integration techniques have been topics of research for the past few years to reduce the parts count, footprint and profile of the passive components, hence increasing the power density of the whole converter. This becomes especially prominent in the distributed power system (DPS) front-end converters, as the trend is moving from 2U (1U=1.75 inches) standard toward 1U standard. This paper presents a comparative study of the integration steps of passive components of an asymmetrical half bridge circuit (AHBC) for DPS front-end DC/DC converter application. Four AHBC converters using discrete passive components, nonplanar integrated magnetic components, planar integrated magnetic components and passive integrated power electronic module (IPEM), respectively, are constructed and tested. Comparisons are made from the viewpoints of volume, profile, efficiency, EMI and thermal performances of the four converters. The experimental result shows that the passive IPEM, which integrates all the passive components, has much higher power density, lowest profile, lower temperature rise and similar efficiency.
Keywords :
DC-DC power convertors; bridge circuits; electromagnetic interference; passive networks; EMI; asymmetrical half bridge circuit; converter efficiency; converter power density; converter profile; converter volume; distributed power system; electromagnetic interference; electromagnetic passive component integration; front-end DC/DC converter; nonplanar integrated magnetic component; passive integrated power electronic module; planar integrated magnetic component; power electronics converters; temperature rise; thermal performance; Bridge circuits; Circuit testing; DC-DC power converters; Electromagnetic interference; Electronic equipment testing; Integrated circuit interconnections; Magnetics; Power electronics; Power system interconnection; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2003. APEC '03. Eighteenth Annual IEEE
Conference_Location :
Miami Beach, FL, USA
Print_ISBN :
0-7803-7768-0
Type :
conf
DOI :
10.1109/APEC.2003.1179359
Filename :
1179359
Link To Document :
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