• DocumentCode
    3175427
  • Title

    Design Patterns for Integrating Variability in Timed Automata

  • Author

    Mitsching, Ralf ; Weise, Carsten ; Kowalewski, Stefan

  • Author_Institution
    Embedded Software Lab., RWTH Aachen Univ., Aachen, Germany
  • fYear
    2010
  • fDate
    9-11 June 2010
  • Firstpage
    38
  • Lastpage
    45
  • Abstract
    Products nowadays come in large number of variants, that allow to tailor products to the specific requirements of the customer. In the production process it is desirable to re-use the common core of product variants, and spend the main effort for an invariant in the development of the individualization of the product. This is true for all kinds of industrial products, including software systems and there specifically embedded systems. Formal approaches in software development are a good way to specifiy products so that common and individual parts can easily be identified. Model based approaches like UML have become widespread in software production. However, model based approaches normally do not support variability management and need to be extended to deal with product variants. For embedded systems, timed automata are a well-established specification formalism. We describe how to extend timed automata to support variability management, and show how a timed automata tool like Uppaal can be used in variability management.
  • Keywords
    automata theory; formal specification; software engineering; UML; design patterns; embedded systems; formal approach; formal specification; model based approach; software development; software production process; software systems; timed automata variability integration; variability management; Automata; Computer industry; Consumer products; Embedded software; Embedded system; Laboratories; Production; Software systems; Testing; Unified modeling language;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Secure Software Integration and Reliability Improvement Companion (SSIRI-C), 2010 Fourth International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-7644-2
  • Type

    conf

  • DOI
    10.1109/SSIRI-C.2010.21
  • Filename
    5521559