• DocumentCode
    3175618
  • Title

    Design and evaluation of SOI devices for radiation environments

  • Author

    Schrimpf, Ron D. ; Alles, M.L. ; Fleetwood, D.M. ; Ball, D.R. ; Gadlage, M.J. ; El Mamouni, F.

  • Author_Institution
    Electr. Eng. & Comput. Sci. Dept., Vanderbilt Univ., Nashville, TN, USA
  • fYear
    2010
  • fDate
    11-14 Oct. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    SOI technologies offer key advantages for use in radiation environments, primarily related to reduced susceptibility to single-event effects. Because of charge trapping in the BOX, however, SOI technologies with light body doping (such as some fully depleted technologies) may be more sensitive to TID than similar bulk technologies. For sub 100-nm technologies, the advantages of SOI technologies related to SEE are less clear than they were in previous earlier technology generations because the critical charge required to upset the circuits is so low. The probability for upset (cross section), however, is lower for SOI circuits because charge collection does not occur over long distances, as it does in bulk technologies. This also reduces the likelihood that a single particle will affect multiple circuits in an IC.
  • Keywords
    electron traps; probability; silicon-on-insulator; SOI devices; charge trapping; light body doping; probability; radiation environments; single-event effects; Charge carrier processes; Leakage current; Logic gates; MOSFETs; Silicon; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference (SOI), 2010 IEEE International
  • Conference_Location
    San Diego, CA
  • ISSN
    1078-621x
  • Print_ISBN
    978-1-4244-9130-8
  • Electronic_ISBN
    1078-621x
  • Type

    conf

  • DOI
    10.1109/SOI.2010.5641470
  • Filename
    5641470