DocumentCode
3175618
Title
Design and evaluation of SOI devices for radiation environments
Author
Schrimpf, Ron D. ; Alles, M.L. ; Fleetwood, D.M. ; Ball, D.R. ; Gadlage, M.J. ; El Mamouni, F.
Author_Institution
Electr. Eng. & Comput. Sci. Dept., Vanderbilt Univ., Nashville, TN, USA
fYear
2010
fDate
11-14 Oct. 2010
Firstpage
1
Lastpage
4
Abstract
SOI technologies offer key advantages for use in radiation environments, primarily related to reduced susceptibility to single-event effects. Because of charge trapping in the BOX, however, SOI technologies with light body doping (such as some fully depleted technologies) may be more sensitive to TID than similar bulk technologies. For sub 100-nm technologies, the advantages of SOI technologies related to SEE are less clear than they were in previous earlier technology generations because the critical charge required to upset the circuits is so low. The probability for upset (cross section), however, is lower for SOI circuits because charge collection does not occur over long distances, as it does in bulk technologies. This also reduces the likelihood that a single particle will affect multiple circuits in an IC.
Keywords
electron traps; probability; silicon-on-insulator; SOI devices; charge trapping; light body doping; probability; radiation environments; single-event effects; Charge carrier processes; Leakage current; Logic gates; MOSFETs; Silicon; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference (SOI), 2010 IEEE International
Conference_Location
San Diego, CA
ISSN
1078-621x
Print_ISBN
978-1-4244-9130-8
Electronic_ISBN
1078-621x
Type
conf
DOI
10.1109/SOI.2010.5641470
Filename
5641470
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