DocumentCode
3176216
Title
Integrated bioflexible electronic device for electrochemical analysis of blood
Author
Babikian, Sarkis ; Li, G.P. ; Bachman, Mark
Author_Institution
Univ. of California Irvine, Irvine, CA, USA
fYear
2015
fDate
26-29 May 2015
Firstpage
685
Lastpage
690
Abstract
We have developed a novel bioflexible electronic device, called “Bioflexible ITP Chip” that integrates Isotachophoresis for biochemical analysis of blood on flexible and conformable circuitry and packaging. The device demonstrates scalable integration and fabrication technologies that are borrowed from the packaging and PCB industry and applied to wearable medical applications. This work demonstrates the possibility of producing flexible and integrated worn-on-the-body microfluidic devices for advanced health monitoring and wound care applications such as a smart bandage. In this paper we describe the fabrication process and the characterization of the biochemical and electronic functions integrated in the bioflexible ITP chip.
Keywords
bioMEMS; biochemistry; biomedical electronics; biomedical telemetry; blood; body sensor networks; electrochemical analysis; electrophoresis; flexible electronics; integrated circuits; intelligent sensors; lab-on-a-chip; microfabrication; microfluidics; patient care; patient monitoring; wounds; PCB industry; advanced health monitoring; biochemical function integration; bioflexible ITP chip fabrication; blood biochemical analysis; blood electrochemical analysis; conformable circuitry; conformable packaging; electronic function integration; fabrication technology; flexible circuitry; flexible microfluidic device production; flexible packaging; integrated bioflexible electronic device; integrated microfluidic device production; isotachophoresis; scalable integration technology; smart bandage; wearable medical application; worn-on-the-body microfluidic device production; wound care application; Biomedical monitoring; Light emitting diodes; Microchannels; Microfluidics; Microscopy; Monitoring; Performance evaluation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location
San Diego, CA
Type
conf
DOI
10.1109/ECTC.2015.7159666
Filename
7159666
Link To Document