Title :
Oxide thickness dependence of nitridation effects on TDDB characteristics
Author :
Mazumder, M.K. ; Teramoto, A. ; Komori, J. ; Mashiko, Y.
Author_Institution :
ULSI Lab., Mitsubishi Electr. Corp., Itami, Japan
Abstract :
Using wet oxide thickness ranging from ~50 to 80 Å, effects of nitridation on time-dependent dielectric breakdown (TDDB) characteristics have been investigated. Results show that capacitors with nitrided oxide have shorter tbd up to a thickness of ~60 Å but turnaround behaviour was found for ~50 Å nitrided oxide. It is suggested that the turnaround behaviour of tbd of nitrided wet oxide of ~50 Å compared to the wet oxide seems to be due to the greater nitrogen concentration at the interface than for thick wet oxide of over 60 Å for the same nitridation conditions
Keywords :
CMOS integrated circuits; MOS capacitors; ULSI; dielectric thin films; electric breakdown; integrated circuit testing; nitridation; oxidation; 50 to 80 angstrom; 60 angstrom; SiO2-Si; SiON-Si; TDDB characteristics; ULSI; capacitors; interface nitrogen concentration; nitridation; nitridation conditions; nitridation effects; nitrided oxide; nitrided wet oxide; oxide thickness dependence; time-dependent dielectric breakdown; turnaround behaviour; wet oxide; wet oxide thickness; Dielectric devices; Electron traps; Fabrication; Hot carriers; Interface states; MOS capacitors; Nitrogen; Semiconductor films; Stress; Ultra large scale integration;
Conference_Titel :
Microelectronic Test Structures, 2001. ICMTS 2001. Proceedings of the 2001 International Conference on
Conference_Location :
Kobe
Print_ISBN :
0-7803-6511-9
DOI :
10.1109/ICMTS.2001.928646