DocumentCode :
3176350
Title :
Accurate CPM based early design stage SERDES PDN optimization in mobile platform
Author :
Yongho Lee ; Sanggwoun Lee ; Jaehyun Park ; Jaemin Shin
Author_Institution :
Syst. LSI, Samsung, Hwaseong, South Korea
fYear :
2015
fDate :
26-29 May 2015
Firstpage :
744
Lastpage :
747
Abstract :
As the demand of faster data rate and power domain sharing for smaller design area increases, power integrity (PI) gets more vulnerable to self and transfer noises. So it is crucial to analyze the overall PDN requirement for reliable system before fabrication. However, the traditional approach using transistor-level analysis could not be applied for a comprehensive analysis due to limited analysis turn-around time. This paper addresses a novel methodology of power delivery network (PDN) co-optimization from chip to board in early design stage to make sure the PDN quality. Accurate CPM (chip power model) is introduced to overcome the simulation time limitation. Novel design optimization method is proposed to get optimal design parameters under the given constraints. Using the proposed methodology, overall PDN design optimization process has been demonstrated with practical examples. In this case study, package design is enhanced by up to ~ 30% inductance improvement and the number of board decoupling capacitors ~ 80% reduction after design optimization.
Keywords :
integrated circuit design; integrated circuit interconnections; integrated circuit noise; integrated circuit packaging; optimisation; transistor circuits; CPM; SERDES PDN optimization; chip power model; comprehensive analysis; data rate; decoupling capacitor; early design stage; inductance improvement; mobile platform; package design; power delivery network cooptimization; power domain sharing; power integrity; transfer noise; transistor-level analysis; Analytical models; Capacitors; Design optimization; Impedance; Noise; Switches; chip power model; chip-package-board; co-optimization; early design stage; power delivery network;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location :
San Diego, CA
Type :
conf
DOI :
10.1109/ECTC.2015.7159674
Filename :
7159674
Link To Document :
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