Title :
Determining the inductance of a through-substrate via using multiple on-wafer test approaches
Author :
Uscola, Ric ; Tutt, Marcel
Author_Institution :
DigitalDNA Labs., Motorola Inc., Tempe, AZ, USA
Abstract :
Four on-wafer measurement approaches for determining the inductance, Lvia, of through-substrate vias used in gallium arsenide (GaAs) monolithic microwave integrated circuits (MMICs) have been implemented and compared. All of the approaches yielded similar results, enabling an accurate estimate for Lvia. The implementations, advantages, and disadvantages of each approach are compared
Keywords :
III-V semiconductors; MMIC; gallium arsenide; inductance; integrated circuit interconnections; integrated circuit metallisation; integrated circuit testing; GaAs; GaAs MMICs; estimation accuracy; gallium arsenide monolithic microwave integrated circuits; inductance; multiple on-wafer test approaches; on-wafer measurement; through-substrate via; Capacitors; Circuit testing; Frequency measurement; Gallium arsenide; Inductance measurement; Microstrip; Microwave integrated circuits; Probes; Through-silicon vias; Transmission line measurements;
Conference_Titel :
Microelectronic Test Structures, 2001. ICMTS 2001. Proceedings of the 2001 International Conference on
Conference_Location :
Kobe
Print_ISBN :
0-7803-6511-9
DOI :
10.1109/ICMTS.2001.928653
