Title :
Die cracking evaluation and improvement in ULSI plastic package
Author :
Chou, Kuo-Yu ; Chen, Ming-Jer ; Lin, Chiu-Ching ; Su, Yen-Shien ; Hou, Chin-Shan ; Ong, Tong-Chern
Author_Institution :
Technol. Reliability Phys. Dept., Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan
Abstract :
A new test chip is specially designed to evaluate large die (12 mm×12 mm, for example) plastic assembly reliability, and is able to sensitively detect die cracking due to thermo-mechanical stresses when undergoing packaging and reliability testing. Die cracking failures are found in chips with six-level Al-0.5Cu metal, and depend strongly upon the encapsulated molding compound material properties during temperature cycling (TC) and thermal shock (TS) testing. While using damascene copper (Cu) technology for the top two metal levels in the same packaging, the chips show no cracking failures during the same reliability testing
Keywords :
ULSI; encapsulation; failure analysis; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; internal stresses; moulding; plastic packaging; thermal shock; thermal stress cracking; thermal stresses; 12 mm; AlCu; Cu; ULSI plastic package; cracking failures; damascene copper technology; die cracking; die cracking detection; die cracking failures; die size; encapsulated molding compound material properties; metal levels; packaging; plastic assembly reliability; reliability testing; six-level Al-Cu metallisation; temperature cycling; test chip; thermal shock testing; thermo-mechanical stresses; Assembly; Copper; Material properties; Plastic packaging; Temperature dependence; Temperature sensors; Testing; Thermal stresses; Thermomechanical processes; Ultra large scale integration;
Conference_Titel :
Microelectronic Test Structures, 2001. ICMTS 2001. Proceedings of the 2001 International Conference on
Conference_Location :
Kobe
Print_ISBN :
0-7803-6511-9
DOI :
10.1109/ICMTS.2001.928669
