DocumentCode :
3176934
Title :
A two step procedure to evaluate contact compatibility of organic materials
Author :
Rieder, Werner F. ; Salzmann, Quido R.
Author_Institution :
Inst. of Switching Devices & High Voltage Technol., Tech. Univ. Wien, Austria
fYear :
1995
fDate :
2-4 Oct. 1995
Firstpage :
267
Lastpage :
273
Abstract :
The formation of carbon on the contact surfaces of commercial relays by thermal decomposition of organic vapors emanating from various organic materials may cause an undesirable increase of the contact resistance in the range of several Ohms. A two stage analysis is proposed, in order to find general rules for the influence of organic materials on contact reliability: The first step of investigation is to determine the molecular structure and quantity of the emanated gases from interesting organic materials by chemical analysis. The second step is to investigate the influence of individual organic vapors and their combinations on contact reliability, using a specially developed test device. The results of preliminary experiments with organic vapors showed that it is possible to determine critical concentrations causing the effect of carbon contamination within a predetermined interval of operations, while lower concentrations did not cause any effect. For organic materials a critical temperature can be determined similarly, as far as a certain temperature of the material corresponds to a certain concentration of emanated gases. Various quantitative informations about contact compatibility of various vapors and materials were gained.
Keywords :
contact resistance; organic compounds; relays; reliability; surface contamination; carbon contamination; chemical analysis; contact compatibility; contact reliability; contact resistance; critical temperature; molecular structure; organic materials; organic vapors; relays; test device; thermal decomposition; Chemical analysis; Contact resistance; Gases; Materials reliability; Organic materials; Relays; Surface resistance; Temperature; Thermal decomposition; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Contacts, 1995., Proceedings of the Forty-First IEEE Holm Conference on
Conference_Location :
Montreal, Quebec, Canada
Print_ISBN :
0-7803-2728-4
Type :
conf
DOI :
10.1109/HOLM.1995.482881
Filename :
482881
Link To Document :
بازگشت