• DocumentCode
    3177102
  • Title

    Inkjet printed single layer high-density circuitry for a MEMS device

  • Author

    Laurila, Mika-Matti ; Soltani, Ayat ; Mantysalo, Matti

  • Author_Institution
    Tampere Univ. of Technol., Tampere, Finland
  • fYear
    2015
  • fDate
    26-29 May 2015
  • Firstpage
    968
  • Lastpage
    972
  • Abstract
    For example high-density redistribution layers (RDL) require narrow conductor width and low enough resistance. We have studied the applicability of an additive electrodynamic inkjet printer, Super Inkjet (SIJ), as a potential replacement for the current non-additive manufacturing method used in circuitry fabrication for MEMS devices. This was done by examining the topography of the printed lines and relating this to the resistance. For example five and two micron wide conductors were demonstrated with aspect ratio as high as 0,8 and 0,9. The average resistivity value for the five micron wide conductors was 17 μOhm·cm and 15 μOhm·cm for the two micron case. Also the repeatability of the line width calibration process was evaluated. The accuracy was found to be approximately one micron.
  • Keywords
    ink jet printing; micromechanical devices; MEMS device; additive electrodynamic inkjet printer; circuitry fabrication; conductor width; high-density redistribution layers; inkjet printed single layer high-density circuitry; line width calibration process; nonadditive manufacturing method; printed lines; super inkjet; wide conductors; Calibration; Conductivity; Conductors; Electrical resistance measurement; Ink; Printing; Resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
  • Conference_Location
    San Diego, CA
  • Type

    conf

  • DOI
    10.1109/ECTC.2015.7159712
  • Filename
    7159712