DocumentCode
3177102
Title
Inkjet printed single layer high-density circuitry for a MEMS device
Author
Laurila, Mika-Matti ; Soltani, Ayat ; Mantysalo, Matti
Author_Institution
Tampere Univ. of Technol., Tampere, Finland
fYear
2015
fDate
26-29 May 2015
Firstpage
968
Lastpage
972
Abstract
For example high-density redistribution layers (RDL) require narrow conductor width and low enough resistance. We have studied the applicability of an additive electrodynamic inkjet printer, Super Inkjet (SIJ), as a potential replacement for the current non-additive manufacturing method used in circuitry fabrication for MEMS devices. This was done by examining the topography of the printed lines and relating this to the resistance. For example five and two micron wide conductors were demonstrated with aspect ratio as high as 0,8 and 0,9. The average resistivity value for the five micron wide conductors was 17 μOhm·cm and 15 μOhm·cm for the two micron case. Also the repeatability of the line width calibration process was evaluated. The accuracy was found to be approximately one micron.
Keywords
ink jet printing; micromechanical devices; MEMS device; additive electrodynamic inkjet printer; circuitry fabrication; conductor width; high-density redistribution layers; inkjet printed single layer high-density circuitry; line width calibration process; nonadditive manufacturing method; printed lines; super inkjet; wide conductors; Calibration; Conductivity; Conductors; Electrical resistance measurement; Ink; Printing; Resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location
San Diego, CA
Type
conf
DOI
10.1109/ECTC.2015.7159712
Filename
7159712
Link To Document