On the technology of planar integrated capacitive-inductive structures for hybrid power electronics

Planar integrated technology for hybrid power electronics can reduce manufacturing costs. The paper investigates the requirements this poses to the constituent technologies used. The production of planar ceramic dielectrics as required for power applications is discussed. Thermal metal spray technology is then investigated as a metallisation step amenable to mass production. To be compatible with integrated hybrid power converters, however, requirements regarding lifetime, conductivity and adhesion to substrates have to be kept in mind. The paper then explains how flame sprayed metallised ceramic dielectric substrates, insulating layers and the necessary ferrites are used to construct integrated capacitive-inductive transformer (LCT) structures for resonant converters. The integrated component is then evaluated in terms of functionality as well as loss performance in a resonant power electronic converter at a power level of 1 kW