Title :
Advanced Microfabrication Techniques for Millimetre Band Cavities
Author :
Verdiel, Marc ; Protz, Jon
Author_Institution :
Duke Univ. Durham, Durham
Abstract :
microfabrication recipe involving Deep Reactive Ion Etching, Chemical Mechanical Polishing, and Silicon Direct Bonding is proposed as a way to fabricate high precision cavities for millimetre band devices. The effect of fabrication variances on device performance is predicted.
Keywords :
integrated circuit bonding; millimetre wave devices; polishing; sputter etching; advanced microfabrication techniques; chemical mechanical polishing; deep reactive ion etching; millimetre band cavities; silicon direct bonding; Chemicals; Etching; Fabrication; Frequency; Intelligent sensors; Passivation; Rough surfaces; Shape control; Silicon; Surface roughness;
Conference_Titel :
Vacuum Electronics Conference, 2007. IVEC '07. IEEE International
Conference_Location :
Kitakyushu
Print_ISBN :
1-4244-0633-1
DOI :
10.1109/IVELEC.2007.4283251
