DocumentCode :
3178597
Title :
Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique
Author :
Li, C.C. ; Hsu, S.J. ; Lee, C.C. ; Liao, L.L. ; Dai, M.J. ; Liu, C.K. ; Zhu, Z.X. ; Yang, H.W. ; Ke, J.H. ; Kao, C. Robert ; Snyder, G.J.
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear :
2015
fDate :
26-29 May 2015
Firstpage :
1470
Lastpage :
1476
Abstract :
In this study, low-temperature Bi2Te3 and mid-temperature PbTe thermoelectric modules are assembled by the technique of Solid Liquid Interdiffusion (SLID). Scanning electron microscope is carried out for issues relating to factors limiting the reliability, growth of intermetallic compounds, and thermal stability. For low-temperature thermoelectric module, N-type Bi2Te3 is bonded to alumina substrates by using a Ni/Sn/Ag system. During bonding and subsequent aging reaction at 200 °C, Sn reacts with Ag to form Ag3Sn, and Ni reacts with Sn to form Ni3Sn4. This reaction process takes less than 72 h to exhaust the entire Sn layer to produce a bonding that can withstand temperature as high as 480 °C. The interfacial reaction, Ni penetration depth, and IMC kinetics between Ni and Bi2Te3 at 200, 250, and 300 °C are also investigated in detail. For mid-temperature thermoelectric module, N-type PbTe is bonded to alumina substrates by using a Ag/In/Ag system. During assembly at 190 °C, all Ag/In/Ag joint are transformed into Ag2In, which has the melting temperature above 670 °C, in less than 2 minutes. Furthermore, this Ag-In joint has passed high temperature storage test at 400 °C for 1000 h. The success of solid liquid interdiffusion technique and related contact materials provide a cost effective way to assemble thermoelectric modules for power generating or cooling applications which require long term operations at high temperatures.
Keywords :
ageing; bismuth alloys; bonding processes; chemical interdiffusion; integrated circuit interconnections; lead alloys; melting; nickel alloys; scanning electron microscopes; silver alloys; tellurium alloys; thermoelectric devices; tin alloys; Ag2In; Ag3Sn; Bi2Te3; IMC kinetics; Ni penetration depth; Ni3Sn4; NiSnAg; PbTe; SLID; alumina substrates; bonding aging reaction; interconnection materials; interfacial reaction; intermetallic compounds; low-temperature thermoelectric modules; melting temperature; mid-temperature thermoelectric modules; scanning electron microscope; solid liquid interdiffusion; subsequent aging reaction; temperature 190 degC; temperature 200 degC; temperature 250 degC; temperature 300 degC; temperature 400 degC; thermal stability; time 1000 h; Aging; Aluminum oxide; Bonding; Gold; Intermetallic; Nickel; Tin; High Temperature Storage; Interfacial Reaction; Solid Liquid Interdiffusion technique; Thermoelectric module;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location :
San Diego, CA
Type :
conf
DOI :
10.1109/ECTC.2015.7159791
Filename :
7159791
Link To Document :
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