Title :
ITherm´98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208)
Abstract :
The following topics were dealt with: thermal control of portable and electronic systems; modelling and characterization of interconnect technologies; C4, chip-scale and BGA; air-cooled heat sinks; natural and forced convection air-cooling; thermal induced phenomena; solder interconnects; interfacial issues in flip chip packaging with underfills; software tools for electronic systems design and analysis; high power electronics; heat pipes use in personal computers
Keywords :
ball grid arrays; chip scale packaging; cooling; electronic engineering computing; flip-chip devices; heat sinks; interconnections; portable computers; software tools; thermal management (packaging); BGA; air-cooled heat sinks; chip-scale; electronic systems; electronic systems design; flip chip packaging; forced convection air-cooling; heat pipes; high power electronics; interconnect technologies; interfacial issues; modelling; natural convection air-cooling; personal computers; portable systems; software tools; solder interconnects; thermal control; thermal phenomena; thermomechanical phenomena; underfills;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-4475-8
DOI :
10.1109/ITHERM.1998.689505
