Relative and absolute warpage modeling on molded packages

Package warpage is an important consideration for mobile device applications. With thinner packages and PoP applications, it is critical that both room temperature and high temperature warpage of the package are measured. Design optimization and material selection also requires simulations to predict warpage, which requires model calibration. Historically, warpage model calibration has been an issue in the industry for many reasons: measurement accuracy, package assembly process, material properties, simulation methodology, etc. This paper addresses these factors and presents a methodology for measured warpage data analysis and its correlation with finite element models.