• DocumentCode
    3179096
  • Title

    Thermal and hydraulic behavior of plate fin and strip fin heat sinks under varying bypass conditions

  • Author

    Jonsson, Hans ; Palm, Björn

  • Author_Institution
    R. Inst. of Technol., Stockholm, Sweden
  • fYear
    1998
  • fDate
    27-30 May 1998
  • Firstpage
    96
  • Lastpage
    103
  • Abstract
    Tests have been conducted in a wind tunnel with nine heat sinks of three different types, including plate fin heat sinks and strip fin heat sinks arranged in both in-line and staggered arrays. For each type, tests were run with fin heights (H) of 10, 20 and 30 mm while the heat sink width (B) was kept constant and equal to 52.8 mm. The wind tunnel duct width (CB) was varied in such a way that results were obtained for B/CB=0.84, 0.67, and 0.33. The wind tunnel height (CH) was varied similarly, and data were recorded for H/CH=1, 0.67, and 0.33 while the duct Reynolds number was varied between 2000 through 14000. An empirical bypass correlation has been fitted to the experimental data. Generally, the agreement between experimental data and correlation is within ±10% for the thermal resistance, and within ±20% for the pressure drop. From the experimental data, the fraction of the total airflow passing through each heat sink has been estimated and is compared to a simple physical bypass model
  • Keywords
    cooling; heat sinks; packaging; thermal analysis; thermal management (packaging); thermal resistance; wind tunnels; 10 mm; 20 mm; 30 mm; 52.8 mm; airflow fraction; bypass conditions; duct Reynolds number; empirical bypass correlation fitting; fin height; heat sink width; heat sinks; hydraulic behavior; in-line heat sink array; physical bypass model; plate fin heat sinks; pressure drop; staggered heat sink array; strip fin heat sinks; thermal behavior; thermal resistance; wind tunnel duct width; wind tunnel height; wind tunnel tests; Ducts; Electronic components; Electronics cooling; Heat sinks; Heat transfer; Refrigeration; Strips; Testing; Thermal resistance; Thermodynamics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
  • Conference_Location
    Seattle, WA
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-4475-8
  • Type

    conf

  • DOI
    10.1109/ITHERM.1998.689525
  • Filename
    689525