• DocumentCode
    3179238
  • Title

    Numerical and experimental analysis of natural convection in a cavity with flush mounted heat sources on a side wall

  • Author

    Ramos, Ruicardo Alan VerdÙ ; Dias, Tito, Jr. ; Milanez, Luiz Fernando

  • Author_Institution
    DEM-FEIS-UNESP, Ilha Solteira, SP, Brazil
  • fYear
    1998
  • fDate
    27-30 May 1998
  • Firstpage
    130
  • Lastpage
    134
  • Abstract
    This work considers a problem of interest in several technological applications, such as the thermal control of electronic equipment. It is also important to study the heat transfer performance of these components under off-normal conditions, such as during cooling fan failure. The effect of natural convection on the flow and heat transfer in a cavity with two flush mounted heat sources on the left vertical wall, simulating electronic components, is studied numerically and experimentally. The influence of the power distribution, spacing between the heat sources and cavity aspect ratio have been investigated. An analysis of the average Nusselt number of the two heat sources was performed to investigate the behaviour of the heat transfer coefficients. The results obtained numerically and experimentally, after an error analysis, showed good agreement
  • Keywords
    cooling; error analysis; failure analysis; flow simulation; heating; natural convection; numerical analysis; thermal analysis; thermal management (packaging); average Nusselt number; cavity air flow; cavity aspect ratio; cavity heat transfer; cavity side wall; component heat transfer performance; cooling fan failure; electronic components; electronic equipment thermal control; error analysis; experimental analysis; flush mounted heat sources; heat source spacing; heat transfer coefficients; natural convection; numerical analysis; off-normal conditions; power distribution; Boundary conditions; Electronic components; Electronic equipment; Electronics cooling; Equations; Fans; Finite volume methods; Heat transfer; Temperature measurement; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
  • Conference_Location
    Seattle, WA
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-4475-8
  • Type

    conf

  • DOI
    10.1109/ITHERM.1998.689530
  • Filename
    689530