DocumentCode
3179614
Title
Three-dimensional graphene-based composite for flexible electronic applications
Author
Bo Song ; Zhenkun Wu ; Yuntong Zhu ; Kyoung-sik Moon ; Wong, C.P.
Author_Institution
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2015
fDate
26-29 May 2015
Firstpage
1803
Lastpage
1807
Abstract
Flexible and stretchable electronics have aroused tremendous attentions in the field of stretchable circuits, wearable electronic devices, artificial tissues and biomedical sensors. To realize the function of these devices, one critical parameter is to retain the high conductivity under mechanical deformations. A solution to this challenge is to form a hybrid conductive architecture where elastomeric components can be integrated. In this research, we report on a facile synthesis of graphene aerogel via spontaneous reduction. The porous structure of the aerogel greatly facilitates the incorporation of poly(dimethylsiloxane) (PDMS) elastomer into the graphene framework. The graphene/PDMS composite has demonstrated a high conductivity of 95 S/m and less than 20% resistance variation under different bending conditions. With unique electrical feature and robust mechanical strength, the as-fabricated graphene/PDMS composite poses the great potential as flexible interconnect materials.
Keywords
aerogels; composite materials; flexible electronics; graphene; C; artificial tissues; biomedical sensors; elastomeric components; electrical feature; facile synthesis; flexible electronic applications; graphene aerogel; graphene framework; graphene/PDMS composite; hybrid conductive architecture; mechanical deformations; poly(dimethylsiloxane) elastomer; porous structure; robust mechanical strength; spontaneous reduction; stretchable circuits; stretchable electronics; three-dimensional graphene-based composite; wearable electronic devices; Conductivity; Graphene; Integrated circuit interconnections; Polymers; Resistance; Zinc;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location
San Diego, CA
Type
conf
DOI
10.1109/ECTC.2015.7159843
Filename
7159843
Link To Document