• DocumentCode
    3179614
  • Title

    Three-dimensional graphene-based composite for flexible electronic applications

  • Author

    Bo Song ; Zhenkun Wu ; Yuntong Zhu ; Kyoung-sik Moon ; Wong, C.P.

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2015
  • fDate
    26-29 May 2015
  • Firstpage
    1803
  • Lastpage
    1807
  • Abstract
    Flexible and stretchable electronics have aroused tremendous attentions in the field of stretchable circuits, wearable electronic devices, artificial tissues and biomedical sensors. To realize the function of these devices, one critical parameter is to retain the high conductivity under mechanical deformations. A solution to this challenge is to form a hybrid conductive architecture where elastomeric components can be integrated. In this research, we report on a facile synthesis of graphene aerogel via spontaneous reduction. The porous structure of the aerogel greatly facilitates the incorporation of poly(dimethylsiloxane) (PDMS) elastomer into the graphene framework. The graphene/PDMS composite has demonstrated a high conductivity of 95 S/m and less than 20% resistance variation under different bending conditions. With unique electrical feature and robust mechanical strength, the as-fabricated graphene/PDMS composite poses the great potential as flexible interconnect materials.
  • Keywords
    aerogels; composite materials; flexible electronics; graphene; C; artificial tissues; biomedical sensors; elastomeric components; electrical feature; facile synthesis; flexible electronic applications; graphene aerogel; graphene framework; graphene/PDMS composite; hybrid conductive architecture; mechanical deformations; poly(dimethylsiloxane) elastomer; porous structure; robust mechanical strength; spontaneous reduction; stretchable circuits; stretchable electronics; three-dimensional graphene-based composite; wearable electronic devices; Conductivity; Graphene; Integrated circuit interconnections; Polymers; Resistance; Zinc;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
  • Conference_Location
    San Diego, CA
  • Type

    conf

  • DOI
    10.1109/ECTC.2015.7159843
  • Filename
    7159843