DocumentCode
3179906
Title
Flexible laser ion sources for surface modification
Author
Boody, F.P. ; Kempf, I. ; Hora, H. ; Hopfl, R. ; Laska, L. ; Krasa, J. ; Juha, L. ; Pfeifer, M. ; Rohlena, K. ; Wolowski, J. ; Woryna, E.
Author_Institution
Ion Light Technol. GmbH, Bad Abbach, Germany
fYear
2003
fDate
22-27 June 2003
Firstpage
582
Abstract
Metal plasma ion immersion implantation has enormously increased the available selection by adding all conductive solid materials and the ability to trade off the amount of material added to the surface and the energy of ions adhering that material to the surface. Most metal plasma implantation has used vacuum arc ion sources. A further increase in flexibility can be added by the use of laser ion sources, which can create high current plasmas of all solid materials and offer an even finer trade-off between plasma ionization spectrum and current. Additionally, with laser ion sources, the laser can be used to micropattern or anneal the surface. The laser ion implantation facility (LIIF) at the Regensburg University of Applied Sciences is designed to study laser ion implantation techniques for industrial application. LIIF is based on a Lambda Physik LPX 315i industrial excimer laser, which produces ≤0.8 J, 20 ns pulses at ≤100 Hz.
Keywords
excimer lasers; ion implantation; ion sources; laser beam annealing; surface treatment; 20 ns; LIIF; Lambda Physik LPX 315i industrial excimer laser; Regensburg University of Applied Sciences; current plasmas; laser ion implantation facility; laser ion source; metal plasma ion immersion implantation; micropattern; plasma ionization spectrum; solid material; surface annealing; surface modification; Conducting materials; Inorganic materials; Ion sources; Laser theory; Optical materials; Plasma immersion ion implantation; Plasma materials processing; Plasma sources; Solids; Surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Europe, 2003. CLEO/Europe. 2003 Conference on
Print_ISBN
0-7803-7734-6
Type
conf
DOI
10.1109/CLEOE.2003.1313644
Filename
1313644
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