• DocumentCode
    3179989
  • Title

    Multiaxial creep behaviour of Indalloy 227 [soldering]

  • Author

    Beaumont, Matthew ; Sun, C.T. ; Li, H.H.

  • Author_Institution
    Purdue Univ., West Lafayette, IN, USA
  • fYear
    1998
  • fDate
    27-30 May 1998
  • Firstpage
    201
  • Lastpage
    204
  • Abstract
    Indalloy 227 (76% Sn/20% In/3% Ag) lead-free solder was investigated. Constant load creep tests were performed for a variety of temperatures and initial stresses to find the behaviour at very low strain rates. The data was collapsed into a single reduced time curve which predicts the steady state creep rate for the material at any combination of tensile loading and temperature. From this data, a multiaxial creep deformation model was developed by defining an effective stress via the von Mises yield criterion. The corresponding effective strain along with the effective stress from the multiaxial loading can be used in the reduced time model to predict creep behaviour for any loading. A combined tension-torsion loading test was devised to verify the three-dimensional model for a variety of multiaxial loadings
  • Keywords
    creep; creep testing; environmental factors; indium alloys; internal stresses; printed circuit testing; silver alloys; soldering; tensile testing; tin alloys; torsion; 3D model verification; Indalloy 227 lead-free solder; Indalloy 227 solder; SnInAg; SnInAg lead-free solder; combined tension-torsion loading test; constant load creep tests; creep behaviour; effective strain; effective stress; initial stresses; material temperature; material tensile loading; multiaxial creep behaviour; multiaxial creep deformation model; multiaxial loading; reduced time curve; reduced time model; steady state creep rate; strain rates; test temperature; von Mises yield criterion; Capacitive sensors; Creep; Environmentally friendly manufacturing techniques; Lead; Performance evaluation; Soldering; Temperature; Tensile stress; Testing; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
  • Conference_Location
    Seattle, WA
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-4475-8
  • Type

    conf

  • DOI
    10.1109/ITHERM.1998.689543
  • Filename
    689543