Ink-jet Printing of Nano Materials and Processes for Electronics Applications

Author

Suganuma, K. ; Wakuda, D. ; Hatamura, M. ; Kim, K.S.

Author_Institution

Inst. of Sci. & Ind. Res., Osaka Univ., Osaka

fYear

2007

fDate

26-28 June 2007

Firstpage

1

Lastpage

4

Abstract

Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ag nanoparticle pastes have been successfully adopted to ink-jet wiring and the multilayered circuit layers in a SiP structure. Ink-jet printing with Ag nano particle pastes demonstrated the potentials of the new printed electronics technology. Lowering process temperature for Ag nanoparticle pastes finally reached room temperature wiring in air atmosphere.

Keywords

integrated circuit interconnections; nanoelectronics; nanoparticles; organic compounds; printed circuits; printing; silver; solvent effects; system-in-package; Ag; SiP structure; electronics applications; ink-jet printing; interconnection; multilayered circuit layers; nanoparticle pastes; nanoprocesses; organic solvent; printed electronics technology; room temperature wiring; silver metallic nanoparticles; temperature 293 K to 298 K; Circuits; Conducting materials; Ink jet printing; Inorganic materials; Nanoparticles; Organic materials; Solvents; Stacking; Temperature; Wiring; Ag nano particles; ink-jet printing; metallic ink; room temperature wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Conference_Location

Shanghai

Print_ISBN

1-4244-1252-8

Electronic_ISBN

1-4244-1253-6

Type

conf

DOI

10.1109/HDP.2007.4283547

Filename

4283547