Densification in Electronics Packaging and Assembly

Author

Hua, Fay

Author_Institution

Intel Corp., Santa Clara, CA

fYear

2007

fDate

26-28 June 2007

Firstpage

1

Lastpage

1

Abstract

Summary form only given. Demand for smaller, faster, and low cost electronics has led the electronics industry move to very fine interconnects on both Ball Grid Array (BGA) surface mount assembly, flip chip packaging level. The trend of densification challenges board assembly material, processes and reliability. HDI PCB materials will become mainstream for electronics to address the increasing I/O density. The electrical, mechanical, thermal and chemical interaction impacts to solder joint reliability needs to be addressed. Low stress flip chip assembly technology will be needed for next generation flip chip technology.

Keywords

ball grid arrays; chip scale packaging; densification; electronics industry; flip-chip devices; integrated circuit interconnections; integrated circuit reliability; solders; surface mount technology; thermal management (packaging); BGA surface mount assembly; ball grid arrays; chemical interaction; densification; electrical interaction; electronics -assembly; electronics packaging; flip chip packaging level; flip chip technology; low stress flip chip assembly technology; mechanical interaction; solder joint reliability; thermal interaction; Assembly; Chemical technology; Costs; Electronic packaging thermal management; Electronics industry; Electronics packaging; Flip chip; Industrial electronics; Materials reliability; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Conference_Location

Shanghai

Print_ISBN

1-4244-1252-8

Electronic_ISBN

1-4244-1253-6

Type

conf

DOI

10.1109/HDP.2007.4283553

Filename

4283553