Integrated RF Passive Filtering Circuits in Organic Package Substrate

Integration of RF passive components like filter, diplexer and matching network on organic substrate are discussed in this paper. These passives are composed of a few lumped elements, mainly inductors and capacitors, which are realized using wind traces or parallel plate with high-k dielectric material sandwiched between them. A few test samples have been fabricated on a multi-layer organic substrate. Measurement results based on two-port VNA have been compared with HFSS simulation results. Good agreement has been observed except that measurement shows more loss in the pass band than the simulation prediction.