Solder Fatigue Study through Finite Element Analysis in a Molded Board Level BGA Module

Author

Zhang, Jack ; Ji, Qing ; Rector, Lou

Author_Institution

Henkel Technol., Irvine

fYear

2007

fDate

26-28 June 2007

Firstpage

1

Lastpage

6

Abstract

Eutectic solders are prone to cold flow and creep in thermal cycle process and therefore prone to fatigue failures. In this paper, eutectic solder fatigue in a molded board level BGA module was studied through finite element analysis. Particularly, the effects of underfilling molding compounds to the stresses and fatigue life of solder balls were investigated. A global finite element model was built to map out the most likely first-fail solder ball. The life cycle of this solder ball was further studied through a more detailed localized finite element model. Improvement of the fatigue life of this solder ball was investigated through optimizing materials properties of the underfilling molding compound.

Keywords

ball grid arrays; eutectic alloys; finite element analysis; solders; board level BGA module; cold flow; eutectic solders; fatigue failures; fatigue life; finite element analysis; solder balls; solder fatigue; thermal cycle process; Capacitive sensors; Creep; Fatigue; Finite element methods; Flip chip; Packaging; Protection; Temperature; Testing; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Conference_Location

Shanghai

Print_ISBN

1-4244-1253-6

Electronic_ISBN

1-4244-1253-6

Type

conf

DOI

10.1109/HDP.2007.4283570

Filename

4283570