Title :
FBGA Die Crack Issue Analysis
Author :
Jiang, Yuqi ; Song, Xianzhong ; Lam, Tim Fai ; Samatitchon, Surasez
Author_Institution :
Spansion (China) Ltd., Suzhou
Abstract :
Die crack issue was found for the electrical failure packages. Failure analysis was performed to characterize the crack line pattern and crack origin. Pick-place and testing operations were examined through FEA modeling. By studying the first principle stress distribution and its vector plot, the critical and possible situations were found.
Keywords :
ball grid arrays; cracks; dyes; finite element analysis; FBGA die crack issue analysis; FEA modeling; electrical failure packages; stress distribution; Acoustic testing; Failure analysis; Inspection; Lead; Material properties; Packaging; Silicon; Sockets; Tensile stress; Thermal force;
Conference_Titel :
High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-1253-6
Electronic_ISBN :
1-4244-1253-6
DOI :
10.1109/HDP.2007.4283571
