Title :
Study of Aluminum Pad Contamination Sources during Wafer Fabrication, Shipping, Storage and Assembly
Author :
Yu, Paul ; Su, Jamie ; Gao, Qiang ; Li, Ming ; Niou, Chorng
Author_Institution :
Semicond. Manuf. Int. (Shanghai) Corp., Shanghai
Abstract :
In this paper, pad contamination sources were summarized and several cases were studied. The fluorine on bond pad was introduced through top metal etch/pad opening process per etch gases or shipping related issue. The higher carbon and oxygen on the abnormal pad were introduced during the process of backside grinding in case.1. The package paper during shipping caused the oxygen and kalium contamination on the abnormal pad in case 2. In case 3, the silicon dust on the abnormal pad formed during die sawing.
Keywords :
aluminium; etching; microassembling; surface contamination; wafer bonding; wafer level packaging; Al; aluminum pad contamination sources; backside grinding process; bond pad; die sawing; kalium contamination; pad opening process; silicon dust; top metal etch process; wafer assembly; wafer fabrication; wafer shipping; wafer storage; Aluminum; Assembly; Contamination; Etching; Fabrication; Gases; Packaging; Sawing; Silicon; Wafer bonding;
Conference_Titel :
High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-1253-6
Electronic_ISBN :
1-4244-1253-6
DOI :
10.1109/HDP.2007.4283573
