Forming High Temperature Solder Interfaces by Low Temperature Fluxless Processing

Author

Lu, Daoqiang Daniel ; Hu, Chuan ; Huang, Annie Tzu-Yu

Author_Institution

lntel Corp., Chandler

fYear

2007

fDate

26-28 June 2007

Firstpage

1

Lastpage

5

Abstract

This paper provides a fundamental study of large area, fluxless bonding with three different solder systems Cu-Sn, Ag-In, and Ag-SnBi, which were pre-deposited in layered structures. The thickness of each individual layer was carefully designed such that, after bonding and annealing at lower temperatures, the final solder interface only had high melting point components and showed higher re-melting points. A systematic bonding study was conducted, and re-melting points and microstructure of the formed solder interface were studied using differential scanning calorimetry (DSC), and scanning electron microsopy (SEM), respectively.

Keywords

annealing; bismuth alloys; bonding processes; copper alloys; differential scanning calorimetry; electronics packaging; high-temperature techniques; indium alloys; interface phenomena; scanning electron microscopy; silver alloys; solders; tin alloys; AgIn; AgSnBi; CuSn; DSC; SEM; annealing; differential scanning calorimetry; fluxless bonding; high melting point components; high temperature solder interface formation; higher re-melting points; low temperature fluxless processing; scanning electron microsopy; solder interface microstructure; systematic bonding study; Annealing; Bonding; Copper; Electronic packaging thermal management; Gold; Microstructure; Silicon; Soldering; Stress; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Conference_Location

Shanghai

Print_ISBN

1-4244-1253-6

Electronic_ISBN

1-4244-1253-6

Type

conf

DOI

10.1109/HDP.2007.4283575

Filename

4283575