• DocumentCode
    3182543
  • Title

    Modelling of Surfactant Mass Balance for Microvia Fill Monitoring

  • Author

    Pohjoranta, A. ; Tenno, R.

  • Author_Institution
    Helsinki Univ. of Technol., Espoo
  • fYear
    2007
  • fDate
    26-28 June 2007
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The mass balance of surface-adsorbing additives in a microvia filling bath is modeled. The model considers the additives´ mass balance between both the solution and the surface-adsorbed layer of additives, as well as on a shape-changing cathode surface, where mass balance of the additives is affected by the surface shape changes. The model is implemented as a finite element model, which applies the arbitrary Lagrange-Eulerian method for tracking the cathode surface shape changes. Further, a weak formulation of the mass balance equations is created in order to enable numerical solution of the model. The model is compared against experiment results.
  • Keywords
    additives; adsorption; filling; finite element analysis; printed circuit manufacture; surfactants; Lagrange-Eulerian method; cathode surface shape tracking; finite element model; mass balance equations; microvia fill monitoring; shape-changing cathode surface; surface-adsorbing additives layer; surfactant mass balance modelling; Additives; Cathodes; Copper; Filling; Finite element methods; Integrated circuit interconnections; Lagrangian functions; Manufacturing processes; Monitoring; Shape;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-1253-6
  • Electronic_ISBN
    1-4244-1253-6
  • Type

    conf

  • DOI
    10.1109/HDP.2007.4283592
  • Filename
    4283592