• DocumentCode
    3182824
  • Title

    Utilizing movement synergies to improve decoding performance for a brain machine interface

  • Author

    Wong, Y.T. ; Putrino, David ; Weiss, Adam ; Pesaran, B.

  • Author_Institution
    Center for Neural Sci., New York Univ. USA, New York, NY, USA
  • fYear
    2013
  • fDate
    3-7 July 2013
  • Firstpage
    289
  • Lastpage
    292
  • Abstract
    A major challenge facing the development of high degree of freedom (DOF) brain machine interface (BMI) devices is a limited ability to provide prospective users with independent control of many DOFs when using a complex prosthesis. It has been previously shown that a large range of complex hand postures can be replicated using a relatively low number of movement synergies. Thus, a high DOF joint space, such as the one the hand resides in, may be decomposed via principal component analysis (PCA) into a lower DOF (eigen-reach) space that contains most of the variance of the original movements. By decoding in this eigen-reach space, BMI users need only control a few eigen-reach values to be able to make movements using all DOFs in the arm and hand. In this paper we examine how using PCA before decoding neural activity may lead to improvements in decoding performance.
  • Keywords
    biomedical equipment; brain-computer interfaces; eigenvalues and eigenfunctions; medical computing; medical control systems; neurophysiology; principal component analysis; prosthetics; BMI users; DOF joint space; PCA; brain machine interface devices; complex hand postures; complex prosthesis; decoding performance; eigen-reach space; eigen-reach values; high degree of freedom; low DOF space; movement synergies; neural activity; principal component analysis; Aerospace electronics; Correlation coefficient; Decoding; Joints; Kalman filters; Principal component analysis; Prosthetics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
  • Conference_Location
    Osaka
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2013.6609494
  • Filename
    6609494