DocumentCode
3183161
Title
Qualification of electronic card assemblies
Author
Fieselman, Charles D. ; Jacomino, John, Jr. ; Trinca, Saverio J.
Author_Institution
IBM Corp., Charlotte, NC, USA
fYear
1993
fDate
4-7 Apr 1993
Firstpage
0.666666666666667
Abstract
As part of the cost of developing a new product, product managers are often willing to pay for qualifying unknown components or subassemblies for their application, in order to ensure that their product will last for its intended life and quality requirements. However, they are unwilling to pay excessive costs over an unacceptable time period to obtain this information. As a result, the Technical Approval Agencies have been driven to find less expensive ways of ensuring reliable products, in a shorter time period, without taking unacceptable risks. One way is by testing more often at the subassembly level than at the component level. The authors discuss the card-assembly-level qualification strategy and look at the advantages of qualifying at this level. They also discuss how the disadvantages are being addressed
Keywords
assembling; electronic equipment testing; environmental stress screening; thermal analysis; MTBF; Technical Approval Agencies; card-assembly-level qualification; electrical stress analysis; electronic card assemblies; environmental stress tests; product development; reliability tests; subassembly testing; thermal analysis; Assembly; Costs; Internal stresses; Qualifications; Temperature; Testing; Thermal stresses; Timing; Vehicles; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Southeastcon '93, Proceedings., IEEE
Conference_Location
Charlotte, NC
Print_ISBN
0-7803-1257-0
Type
conf
DOI
10.1109/SECON.1993.465719
Filename
465719
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