• DocumentCode
    3183161
  • Title

    Qualification of electronic card assemblies

  • Author

    Fieselman, Charles D. ; Jacomino, John, Jr. ; Trinca, Saverio J.

  • Author_Institution
    IBM Corp., Charlotte, NC, USA
  • fYear
    1993
  • fDate
    4-7 Apr 1993
  • Firstpage
    0.666666666666667
  • Abstract
    As part of the cost of developing a new product, product managers are often willing to pay for qualifying unknown components or subassemblies for their application, in order to ensure that their product will last for its intended life and quality requirements. However, they are unwilling to pay excessive costs over an unacceptable time period to obtain this information. As a result, the Technical Approval Agencies have been driven to find less expensive ways of ensuring reliable products, in a shorter time period, without taking unacceptable risks. One way is by testing more often at the subassembly level than at the component level. The authors discuss the card-assembly-level qualification strategy and look at the advantages of qualifying at this level. They also discuss how the disadvantages are being addressed
  • Keywords
    assembling; electronic equipment testing; environmental stress screening; thermal analysis; MTBF; Technical Approval Agencies; card-assembly-level qualification; electrical stress analysis; electronic card assemblies; environmental stress tests; product development; reliability tests; subassembly testing; thermal analysis; Assembly; Costs; Internal stresses; Qualifications; Temperature; Testing; Thermal stresses; Timing; Vehicles; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Southeastcon '93, Proceedings., IEEE
  • Conference_Location
    Charlotte, NC
  • Print_ISBN
    0-7803-1257-0
  • Type

    conf

  • DOI
    10.1109/SECON.1993.465719
  • Filename
    465719