• DocumentCode
    3183563
  • Title

    Study of layout-effect based on S-parameter extracted by full-wave EM simulation for CMOS RFIC design

  • Author

    Liu Yang ; Choi, Sungju ; Kim, Joonchul ; Kim, Hyeongdong

  • Author_Institution
    Dept. of Electron. & Comput. Eng., Hanyang Univ., Seoul, South Korea
  • fYear
    2009
  • fDate
    7-10 Dec. 2009
  • Firstpage
    2598
  • Lastpage
    2601
  • Abstract
    Layout parasitic components can significantly affect the performance of CMOS RF integrated circuits, and can even make a totally different representation from the circuit designed in schematic. This paper proposes a fast approach to identify the layout effect based on S-parameter of on-chip interconnect structures extracted by 3D full-wave EM simulation. In order to confirm the accuracy of modeled on-chip passive devices used in the approach, S-parameter of interconnections is firstly computed at DC and compared with schematic simulation result. CMOS RF poly-phase filter, as a design example is presented in this paper, where I/Q path mismatch effect and geometric effect are disclosed. Experimental results demonstrate that layout effect can be definitely non-negligible.
  • Keywords
    CMOS integrated circuits; S-parameters; radiofrequency filters; radiofrequency integrated circuits; 3D full-wave EM simulation; CMOS RF integrated circuits; CMOS RF polyphase filter; S-parameter; layout parasitic components; on-chip interconnect structures; CMOS integrated circuits; Circuit simulation; Computational modeling; Integrated circuit interconnections; Integrated circuit layout; Radio frequency; Radiofrequency identification; Radiofrequency integrated circuits; Scattering parameters; Semiconductor device modeling; Black-box; CMOS; Poly-phase filter; Quadrature; RFIC; S-parameter; electromagnetic; full wave; interconnects; on-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2009. APMC 2009. Asia Pacific
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2801-4
  • Electronic_ISBN
    978-1-4244-2802-1
  • Type

    conf

  • DOI
    10.1109/APMC.2009.5385243
  • Filename
    5385243