Investigation of the Effect of Processing Variables on the Structure and Morphology of Nano-TIM

Thermal management in electronics packaging is becoming more rigorous with the increase of IC power. A common method is to transfer heat from the heat generating devices using a heat dissipation member, for example heat sink. Thermal interface material (TIM) is applied between the heat source component and the thermally conductive member to offer a fast heat dissipation path. Nano thermal interface material (Nano-TIM) is a newly developed thermal conductive material with good performance and low cost. Electrospinning is a fiber spinning process to produce TIM in nano scale. Processing variables involved in the process have a great effect on the properties of electrospun Nano-TIM. The major emphasis of this paper is on the Nano-TIM manufacturing process and the effect of the processing variables on the structure and morphology of Nano-TIM. Scanning electron microscope (SEM) was used to study the TIM structure.