DocumentCode
318408
Title
The search for the universal probe card solution
Author
Bates, R. Dennis
fYear
1997
fDate
1-6 Nov 1997
Firstpage
533
Lastpage
538
Abstract
Epoxy Ring, Cobra, and other new products are evaluated against the demand for high pin count, high frequency, high temperature, multi-DUT, long life, etc. There doesn´t appear to be a single universal solution, but rather each technology provides a usable response to the growing wafer test requirements. However, the climate is right for creativity and innovation to meet the challenges of the future
Keywords
automatic test equipment; integrated circuit testing; printed circuit testing; Ceprobe; Cobra; Epoxy Ring; high frequency; high pin count; high temperature; membrane probe; multi-DUT; photolithography; universal probe card solution; Aluminum; Atherosclerosis; Circuit testing; Geometry; Gold alloys; Integrated circuit technology; Lead; Probes; Temperature; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1997. Proceedings., International
Conference_Location
Washington, DC
ISSN
1089-3539
Print_ISBN
0-7803-4209-7
Type
conf
DOI
10.1109/TEST.1997.639661
Filename
639661
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