• DocumentCode
    318408
  • Title

    The search for the universal probe card solution

  • Author

    Bates, R. Dennis

  • fYear
    1997
  • fDate
    1-6 Nov 1997
  • Firstpage
    533
  • Lastpage
    538
  • Abstract
    Epoxy Ring, Cobra, and other new products are evaluated against the demand for high pin count, high frequency, high temperature, multi-DUT, long life, etc. There doesn´t appear to be a single universal solution, but rather each technology provides a usable response to the growing wafer test requirements. However, the climate is right for creativity and innovation to meet the challenges of the future
  • Keywords
    automatic test equipment; integrated circuit testing; printed circuit testing; Ceprobe; Cobra; Epoxy Ring; high frequency; high pin count; high temperature; membrane probe; multi-DUT; photolithography; universal probe card solution; Aluminum; Atherosclerosis; Circuit testing; Geometry; Gold alloys; Integrated circuit technology; Lead; Probes; Temperature; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1997. Proceedings., International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-4209-7
  • Type

    conf

  • DOI
    10.1109/TEST.1997.639661
  • Filename
    639661