DocumentCode :
3184695
Title :
A magnetic fluid seal for rotary blood pumps: Image and computational analyses of behaviors of magnetic fluids
Author :
Mitamura, Yoshinori ; Yano, Takao ; Okamoto, Eiji
Author_Institution :
Grad. Sch. of Inf. Sci. & Technol., Hokkaido Univ., Sapporo, Japan
fYear :
2013
fDate :
3-7 July 2013
Firstpage :
663
Lastpage :
666
Abstract :
A magnetic fluid (MF) seal has excellent durability. The performance of an MF seal, however, has been reported to decrease in liquids (several days). We have developed an MF seal that has a shield mechanism. The seal was perfect for 275 days in water. To investigate the effect of a shield, behaviors of MFs in a seal in water were studied both experimentally and computationally. (a) Two kinds of MF seals, one with a shield and one without a shield, were installed in a centrifugal pump. Behaviors of MFs in the seals in water were observed with a video camera and high-speed microscope. In the seal without a shield, the surface of the water in the seal waved and the turbulent flow affected behaviors of the MFs. In contrast, MFs rotated stably in the seal with a shield in water even at high rotational speeds. (b) Computational fluid dynamics analysis revealed that a stationary secondary flow pattern in the seal and small velocity difference between magnetic fluid and water at the interface. These MF behaviors prolonged the life of an MF seal in water.
Keywords :
blood; computational fluid dynamics; haemorheology; magnetic fluids; turbulence; video cameras; water; H2O; MF seal performance; centrifugal pump; computational analysis; computational fluid dynamic analysis; durability; high rotational speeds; high-speed microscope; image analysis; magnetic fluid seal; rotary blood pumps; seal wave; stationary secondary flow pattern; turbulent flow affected behaviors; video camera; water surface; Blood; Computational fluid dynamics; Magnetic liquids; Pumps; Seals; Shafts;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2013.6609587
Filename :
6609587
Link To Document :
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