Title :
Packaging multichip modules (MCMs) into SEM-E configurations
Author :
Horner, Donald W. ; Alper, Daniel D.
Author_Institution :
Environmental Res. Inst. of Michigan, Ann Arbor, MI, USA
Abstract :
The authors describe, in the context of a particular processor system development, a multichip module (MCM) technology aimed at meeting the challenges of application of advanced digital electronics systems in military platforms. In 1989, ERIM began a program to develop a multimodal advanced target recognition (ATR) processing engine. The ATR processor can be configured in any of several physical forms. One configuration is a standard electronics module (SEM-E) frame that fits a 3/4-width standard air transportable rack chassis. This configuration must have a backplane interconnect because of the chassis type. The work to date has developed the electrical, mechanical, and thermal packaging designs that are outlined
Keywords :
heat sinks; integrated circuit technology; military computing; military equipment; multichip modules; packaging; pattern recognition equipment; semiconductor technology; ERIM; air transportable rack chassis; backplane interconnect; digital electronics; electrical design; mechanical design; military platforms; multichip module; multimodal advanced target recognition; packaging; processing engine; standard electronics module; thermal design; Costs; Dielectric substrates; Electronics packaging; Engines; Integrated circuit interconnections; Multichip modules; Sensor arrays; Silicon; Target recognition; Voltage;
Conference_Titel :
Aerospace and Electronics Conference, 1992. NAECON 1992., Proceedings of the IEEE 1992 National
Conference_Location :
Dayton, OH
Print_ISBN :
0-7803-0652-X
DOI :
10.1109/NAECON.1992.220572
