DocumentCode :
3185657
Title :
Strain-sensing element based on layered sulfide Mo0.95Re0.05S2
Author :
Kuznetsov, V.A. ; Berdinsky, A.S. ; Ledneva, A.Yu. ; Artemkina, S.B. ; Tarasenko, M.S. ; Fedorov, V.E.
Author_Institution :
Novosibirsk State Tech. Univ., Novosibirsk, Russia
fYear :
2015
fDate :
25-29 May 2015
Firstpage :
15
Lastpage :
18
Abstract :
The work presents a study of piezoresistive effect of thin films of rhenium-doped molybdenum disulfide of composition Mo0.95Re0.05S2 possessing layered structure of 2H-MoS2 type. The compound was synthesized by high temperature ampoule method using stoichiometric mixture of elements. The thin films were formed by spraying colloidal dispersion produced by liquid exfoliation of solid phase in mixed solvent EtOH/H2O. The phase Mo0.95Re0.05S2 is semiconductor with effective activation energy of about 150 meV estimated from temperature dependences of resistance of the films. The dependence of resistance on deformation is presented. It has almost linear type and good reproducibility during a sinusoidal alternating load of 0.12% deformation amplitude. The strain gauge factor of 12 and 24 was obtained depending on preparation details from room temperature measurements using a beam of uniform strength (in bending).
Keywords :
bending strength; molybdenum compounds; piezoresistance; rhenium compounds; semiconductor thin films; spraying; stoichiometry; strain gauges; strain sensors; thin film sensors; Mo0.95Re0.05S2; activation energy; bending strength; deformation amplitude; high temperature ampoule method; layered structure; layered sulfide; liquid exfoliation; mixed solvent; piezoresistive effect; rhenium-doped molybdenum disulfide; semiconductor materials; sinusoidal alternating load; solid phase; spraying colloidal dispersion; stoichiometric mixture; strain gauge factor; strain-sensing element; thin films; Electrical resistance measurement; Films; Piezoresistance; Strain; Temperature; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Information and Communication Technology, Electronics and Microelectronics (MIPRO), 2015 38th International Convention on
Conference_Location :
Opatija
Type :
conf
DOI :
10.1109/MIPRO.2015.7160230
Filename :
7160230
Link To Document :
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