Title :
Methodology for predicting pin-fin fan-sink performance
Author :
Wirtz, R.A. ; Zheng, Nanning
Author_Institution :
Dept. of Mech. Eng., Nevada Univ., Reno, NV, USA
Abstract :
A semi-empirical algorithm for determining the operating point and overall thermal conductance of a fan-sink assembly is developed. The algorithm links the fan characteristic equation to the heat sink pressure drop characteristic in the determination of assembly operating point. Three modeling scenarios for the fan characteristic equation are described and tested. Simple techniques for the measurement of fan-sink performance are used to develop a heat-sink heat transfer/pressure drop data base. Performance measurements with commercial fan-sinks show the calculation methodology developed can be used to accurately predict assembly performance. The effect of variations in heat sink geometry on overall fan-sink performance is described
Keywords :
cooling; heat sinks; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; thermal analysis; thermal conductivity; thermal management (packaging); thermal variables measurement; assembly operating point; assembly performance; fan characteristic equation; fan-sink assembly; fan-sink performance; fan-sink performance measurement; fan-sinks; heat sink geometry; heat sink pressure drop characteristic; heat-sink heat transfer/pressure drop data base; modeling scenarios; operating point; pin-fin fan-sink performance prediction methodology; semi-empirical algorithm; thermal conductance; Assembly; Coolants; Heat sinks; Heat transfer; Performance analysis; Surface discharges; Temperature; Thermal conductivity; Thermal factors; Thermal resistance;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4475-8
DOI :
10.1109/ITHERM.1998.689578
