DocumentCode
318713
Title
Device and technology challenges for 0.1 μm CMOS
Author
Wong, S. Simon
Author_Institution
Hong Kong Univ. of Sci. & Technol., Kowloon, Hong Kong
fYear
1997
fDate
35672
Firstpage
1
Abstract
Summary form only given. The integrated circuit industry is poised to introduce 0.25 μm products before the end of this year, and is projected to deliver 0.1 μM process in less than 10 years. We will review the challenges ahead and focus on the research opportunities in device and process technology
Keywords
CMOS integrated circuits; integrated circuit technology; technological forecasting; 0.1 micron; CMOS integrated circuits; device technology; process technology; CMOS process; CMOS technology; Electronics industry; Integrated circuit technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1997. Proceedings., 1997 IEEE Hong Kong
Print_ISBN
0-7803-3802-2
Type
conf
DOI
10.1109/HKEDM.1997.641997
Filename
641997
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