• DocumentCode
    318719
  • Title

    A comparative study of p-type diffusion in III-V compound semiconductors

  • Author

    Weng, Tung H.

  • Author_Institution
    Sch. of Eng. & Comput. Sci., Oakland Univ., Rochester, MI, USA
  • fYear
    1997
  • fDate
    35672
  • Firstpage
    120
  • Lastpage
    122
  • Abstract
    In this paper, the different behavior of zinc diffusion in GaAs and InP is described. The diffusion technique used in this study was a semi-sealed quartz bottle containing diffusion charges and GaAs or InP wafers. The basic requirement for zinc diffusion in these materials is to provide an overpressure ambient so that decomposition at the diffusion temperature can be avoided. For InP, a small amount of InP powder along with zinc in the diffusion charge was required in order to avoid the decomposition at the diffusion temperature of about 600°C. For GaAs, however, no GaAs powder was needed in the diffusion charge. Only pure zinc was required for producing heavily doped P-layer at the diffusion temperature of about 500°C
  • Keywords
    III-V semiconductors; diffusion; gallium arsenide; heavily doped semiconductors; indium compounds; semiconductor doping; zinc; 500 to 600 C; GaAs:Zn; III-V compound semiconductor; InP:Zn; decomposition; heavily doped layer; overpressure ambient; p-type diffusion; powder; semi-sealed quartz bottle; Density measurement; Gallium alloys; Gallium arsenide; III-V semiconductor materials; Indium phosphide; Land surface temperature; Nitrogen; Powders; Surface resistance; Temperature; Zinc;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1997. Proceedings., 1997 IEEE Hong Kong
  • Print_ISBN
    0-7803-3802-2
  • Type

    conf

  • DOI
    10.1109/HKEDM.1997.642347
  • Filename
    642347