DocumentCode
318719
Title
A comparative study of p-type diffusion in III-V compound semiconductors
Author
Weng, Tung H.
Author_Institution
Sch. of Eng. & Comput. Sci., Oakland Univ., Rochester, MI, USA
fYear
1997
fDate
35672
Firstpage
120
Lastpage
122
Abstract
In this paper, the different behavior of zinc diffusion in GaAs and InP is described. The diffusion technique used in this study was a semi-sealed quartz bottle containing diffusion charges and GaAs or InP wafers. The basic requirement for zinc diffusion in these materials is to provide an overpressure ambient so that decomposition at the diffusion temperature can be avoided. For InP, a small amount of InP powder along with zinc in the diffusion charge was required in order to avoid the decomposition at the diffusion temperature of about 600°C. For GaAs, however, no GaAs powder was needed in the diffusion charge. Only pure zinc was required for producing heavily doped P-layer at the diffusion temperature of about 500°C
Keywords
III-V semiconductors; diffusion; gallium arsenide; heavily doped semiconductors; indium compounds; semiconductor doping; zinc; 500 to 600 C; GaAs:Zn; III-V compound semiconductor; InP:Zn; decomposition; heavily doped layer; overpressure ambient; p-type diffusion; powder; semi-sealed quartz bottle; Density measurement; Gallium alloys; Gallium arsenide; III-V semiconductor materials; Indium phosphide; Land surface temperature; Nitrogen; Powders; Surface resistance; Temperature; Zinc;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1997. Proceedings., 1997 IEEE Hong Kong
Print_ISBN
0-7803-3802-2
Type
conf
DOI
10.1109/HKEDM.1997.642347
Filename
642347
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